MEMS Design Shrinks Speakers to Chip Scale
Article By : R. Colin Johnson, EE Times
USound has developed microelectromechanical system (MEMS) chip-scale audio speakers, targeting in- and over-ear high-fidelity earbuds, smartphones, multidriver headphones, and other IoT wearables.
LAKE WALES, Fla. — Microelectromechanical-system-based audio speakers for earbuds, smartphones, wearables and other Internet of Things (IoT) devices have proved a tough row to hoe. But USound GmbH (Graz, Austria) now says it will be first to market with a family of MEMS audio speakers, with production volumes planned for the first quarter.
USound calls its MEMS speaker Ganymede and says it will offer a reference design, called Magaclite, by the end of this year. The devices have been fitted to high-end sunglasses and are being developed for earbuds; smartphones; and multidriver, high-fidelity above-ear speakers.
“It was a challenge to make the tiny MEMS drivers sound good,” Mark Laich, USound senior business development adviser, told EE Times at SEMI’s MEMS & Sensor Executive Congress (San Jose, Calif.) earlier this month. The difficulties can be chalked up to the physics of sound, which dictates that the cone size pushing the air be proportional to the wavelength of the sounds emitted. High-fidelity home speaker systems use 12- to 15-inch bass drivers along with midrange drivers in the 3-to-6 inch range and high-frequency tweeters as small as (and sometimes smaller than) an inch.
For wearables, the proportions of the driver’s size must be some small fraction of the wavelength of the sounds emitted plus some mechanical or electronic frequency equalization to make them sound truly high fidelity. High-end headphones, and even some expensive earbuds, use multiple drivers to achieve the highest fidelity. Most reasonably priced earbuds sacrifice fidelity for frugality by using a single driver plus a lot of electronic equalization.
USound has partnerships with Austria Technologie & Systemtechnik AG, for AT&S’ tiny printed-circuit boards; the Fraunhofer Institute for Silicon Technology, for ISIT’s expertise in producing power electronics for microsystems; the Institute for Electronic Music, for IEM’s interface expertise between acoustic technologies and audio practice; and STMicroelectronics, for ST’s manufacturing expertise in robotic ears.
— R. Colin Johnson, Advanced Technology Editor, EE Times
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