SMD Components for Audio, RF, Ultrasound, USID and Communication Systems

SMD Components for Audio, RF, Ultrasound, USID

and Communication Systems

CMOS/MEMS Microphones, MEMS Speakers, and USID-Related SMD Components

Author: Richard Jan Azim Svanberg

Date: August 8, 2026

Version: 1.0

Copyright © 2026 Richard Jan Azim Svanberg. All rights reserved.

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0Question: Include SMD components, including CMOS/MEMS microphones, CMOS/MEMS speakers, and USID

components that are SMD components. List the SMD components.

Answer:

SMD Components for Modern Audio, RF, Ultrasound, and

Communication Systems

• SMD resistors

• Capacitors (MLCC ceramic capacitors)

• SMD inductors

• Ferrite beads

• Diodes (Schottky, Zener, and TVS diodes)

• Transistors (BJT and MOSFET)

• Operational amplifier ICs

• LDO voltage regulators

• DC/DC converters

• Crystals and oscillators

• MEMS oscillators (SMD)

• SAW filters

• RF filters

• Antenna-matching components

• RF switches

• RF amplifiers (LNA and PA)

• RF transceivers (MICS/MedRadio, Bluetooth, BLE)

• Microcontroller (MCU)

• DSP

• Flash memory

• SRAM

• EEPROM

• PMIC

• Battery-charging ICs

• Audio codec

• DAC

• ADC

• Audio amplifier (Class-D)

• ESD protection components

• SMD connectors and test points

CMOS- and MEMS-Based SMD Components

• CMOS/MEMS microphone (SMD MEMS microphone)

• CMOS image sensor

• MEMS speaker (SMD MEMS speaker)

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0• MEMS pressure sensor

• MEMS accelerometer

• MEMS gyroscope

• MEMS magnetometer

• MEMS temperature sensor

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0USID- and Ultrasound-Based SMD Components

USID (Ultrasound Identification) can be built using very small SMD and MEMS components for ultrasound

communication, identification, power transfer, and backscatter.

• MEMS ultrasonic transducer (MUT)

• Piezoelectric ultrasonic transducer in an SMD package

• PMUT - Piezoelectric Micromachined Ultrasonic Transducer

• CMUT - Capacitive Micromachined Ultrasonic Transducer

• SMD ultrasonic transmitter

• SMD ultrasonic receiver

• Ultrasonic transceiver

• Ultrasound AFE (Ultrasound Analog Front End)

• Ultrasound driver / high-voltage pulser

• Low-noise amplifier for ultrasound (LNA)

• Programmable gain amplifier (PGA)

• Transimpedance amplifier (TIA)

• ADC for ultrasound signals

• DAC for ultrasound signals

• Comparators for ultrasound detection

• Band-pass filters for ultrasound

• LC matching networks

• Impedance-matching components for ultrasonic transducers

• SMD inductors for resonance and matching circuits

• SMD capacitors for resonance and matching circuits

• MOSFET driver for ultrasonic transducer

• Analog switch / multiplexer

• T/R switch (Transmit/Receive Switch)

• Envelope detector

• Demodulator

• Modulator

• Backscatter modulator

• Load-modulation switch

• Schottky rectifier

• RF/ultrasound rectifier

• Energy-harvesting IC

• Power-management IC for ultrasound power

• SMD storage capacitor

• Microcontroller (MCU) for the USID protocol

• Ultra-low-power DSP

• ASIC for USID/ultrasound communication

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0• EEPROM/Flash for identification data

• Sensor interface

• Clock generator / MEMS oscillator

• ESD and surge protection

• SMD test points

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0Examples of CMOS/MEMS Components

CMOS/MEMS Microphones

• Knowles SPH0645LM4H-B

• Knowles SPH0655LM4H

• TDK InvenSense ICS-43434

• Infineon IM69D130

• STMicroelectronics MP23DB01HP

MEMS Speakers

• xMEMS Cowell XSC-2100

• xMEMS Cowell XSC-2150

• xMEMS Montara XSM-2400

• xMEMS Montara Plus XSM-2400-S

Example Component Types for a USID System

A compact USID system could, for example, consist of:

• SMD/MEMS ultrasonic transducer

• PMUT or CMUT

• Ultrasound driver

• Ultrasound AFE

• LNA

• ADC/DAC

• MCU or ASIC

• DSP

• Backscatter modulator

• MOSFET switch

• Schottky diode

• Rectifier

• Energy-harvesting IC

• PMIC

• SMD capacitors

• SMD inductors

• Matching network

• MEMS oscillator

• Flash/EEPROM

• ESD protection

Such a system can be designed so that the ultrasonic transducer is used to transmit and/or receive ultrasound

signals. The electronics can then amplify, filter, digitize, modulate, or demodulate the signals.

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0Energy-Efficient USID Operation

For highly energy-efficient USID systems, an incoming ultrasound signal can also, in principle, be used together

with energy harvesting and backscatter/load modulation, where the device changes its electrical load to influence

the reflected ultrasound signal.

Technical Explanation

Technically, CMOS/MEMS microphones and MEMS speakers are also SMD components because they are

supplied in surface-mount packages (Surface-Mount Device).

CMOS describes the integrated electronics used for signal processing and control, while MEMS describes the

micromechanical structure.

Similarly, a USID system can be built from SMD and MEMS components. However, USID is not itself a specific

type of SMD component; rather, it is a system principle for ultrasound-based identification or communication. A

USID system can therefore include, for example, a MEMS ultrasonic transducer, amplifiers, filters, an MCU/ASIC,

a modulator, power-management circuitry, and passive SMD components.

PMUT and CMUT components are particularly interesting for very small ultrasound systems because the ultrasonic

transducer itself can be fabricated using microsystem technology and integrated with CMOS electronics in highly

compact systems.

Copyright © 2026 Richard Jan Azim Svanberg | Version 1.0